Frequently asked questions
What is RK182X 3D RAM Stacking Development Kit used for?
RK182X 3D RAM Stacking Development Kit is a Embedded Computing from Firefly. It is typically used in embedded computing, edge AI inference, industrial control and rapid prototyping, and can be integrated into custom carrier boards or finished devices.
Does RK182X 3D RAM Stacking Development Kit include technical support, datasheets or pre-flashed images?
Yes. Ai-Paipai supplies this item as an authorized distributor and provides local engineering support, datasheets, SDKs and pre-flashed system images where applicable, plus OEM / ODM customization for volume projects.
Can I order RK182X 3D RAM Stacking Development Kit with OEM / ODM options or CE / FCC / RoHS certification?
OEM / ODM customization (specs, enclosure, BSP) is available, and CE / FCC / RoHS certified options can be provided on request for EU and US imports. Contact us for a quote.
How is RK182X 3D RAM Stacking Development Kit shipped, and what is the lead time?
Orders ship worldwide from Shenzhen. Stock items typically dispatch within a few business days; configurable or made-to-order variants take longer. Exact lead time is shown at checkout or on request.
Specifications
| Product Datasheet | Click Here |
| Product Wiki | Click Here |
| Dual-Core Design for Multi-Task Processing | The Rockchip RK3588+RK182X architecture enables efficient collaboration through PCIe interconnection. |
| High-Bandwidth DRAM | It integrates high-bandwidth embedded DRAM (2.5GB/5GB versions), with a token generation rate exceeding 100 tokens/second and end-to-end latency as low as 0.1 seconds. |
| Millisecond-Level Low Latency | The dedicated RK182X NPU, coordinated by the RK3588, enables real-time decision-making even in poor network conditions, thereby improving the reliability and security of critical applications such as medical monitoring and autonomous driving. |


